几个IC术语

wafer(晶圆)   
nAFV%F,w0A thin, round slice of semiconductor material, typically silicon, from which microchips are made. Silicon is processed into large cylindrical ingots, sliced into ultra-thin wafers and then implanted with transistors before being cut into smaller semiconductor chips.  
o&Lr2h#~iK0晶圆是制造IC的基本原料，晶圆便是硅元素加以纯化（99.999%），接着是将这些纯硅制成长硅晶棒，成为制造集成电路的石英半导体的材料，经过照相制版，研磨，抛光，切片等程序，将多晶硅融解拉出单晶硅晶棒，然后切割成一片一片薄薄的晶圆。我们听到的6寸、8寸、12寸的晶圆场中，12寸晶圆有较高的产能，因为硅晶圆的直径越大，代表著这座晶圆厂有较好的技术。晶圆越大,同一圆片上可生产的IC就多,可降低成本;但要求材料技术和生产技术更高。EDA中国门户网站n2SWh(kz

die   
2YN-KFog0(plural dies or dice) A square of silicon that contains an integrated circuit. EDA中国门户网站M^!ld;^#y.H^)B6z1k2i%O
Die often is used synonymously with chip.
A Z'N?/@%B0die就是ic未封装前的晶粒,是从硅晶片(wafer)上用激光切割下,把die焊在框架上,再在die上面焊接上金线后形成ic裸芯片,再拿去塑封.
6?9t+Ff4[ D!Nw0将半导体大圆片(Wafer)分割而成的小片(Die)。它可有一个或多个电路,但作为一个单位封装而成EDA中国门户网站P5A6h\Y1o#L
DIE是个单词，他的原本意义有模的意思，引申为管芯，模片的意思。以下为美国传统词典解释：
@3?*qQH0die
4}WU'h z0管芯;［小片］EDA中国门户网站0m9I7q`%W}-o x
A single piece of semiconductor material that has been cut from a slice by scribing and breaking. It can contain one or more circuits but is packaged as a unit.
1F(\;q'IX+aKA-H0将半导体大圆片分割而成的小片。它可有一个或多个电路,但作为一个单位封装而成。
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MEMSEDA中国门户网站2M"I7nLy7^
Micro-Electro-Mechanical System 微电子机械系统EDA中国门户网站j"uA)?(g?

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Monolithic Microwave IC 单片微波IC EDA中国门户网站}+G e ls0DK-\

SSI (small-scale integration)   Up to 100 electronic components per chip
_z XUt \eo0MSI (medium-scale integration)  From 100 to 3,000 electronic components per chip EDA中国门户网站!I:{9[.RTRj;m
LSI(large-scale integration)    From 3,000 to 100,000 electronic components per chip
LP z1h4wC5p7i0VLSI(very large-scale integration)  From 100,000 to 1,000,000 electronic components per chip EDA中国门户网站{8zB-n*Cn/~Kl
ULSI(ultra large-scale integration) More than 1 million electronic components per chip

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SoC(System in a Chip)系统级芯片
&j1Sh8m^ E-["OE0SiP(System in Package)系统级封装
~_H&T6s:O0MCP(Multi-Chip Packaging)多芯片封装EDA中国门户网站+o0Kb$m| b
SCSP(Stacked chip size package)芯片堆叠封装EDA中国门户网站 xX0n,J#R^v3|2u.TL

*Ut#JO)C^)s0NRE(Nonrecurring Costs)一次性费用、开发成本 EDA中国门户网站#[y5{&x vAN-LF/aD
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Prototype样品
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[;x#u;rVj^o.Y]0LDO--Low Dropout Regulator低压降稳压器，一种的新型供电电路，在便携设备和无线产品的电源管理中广泛用到，它能够保证系统高可靠性、高性能指标的要求，并有效地延长电池寿命。其突出优点是具有最低的成本，最低的噪声和最低的静态电流。它的外围器件也很少，通常只有一两个旁路电容。新型LDO可达到以下指标：30μV 输出噪声、60dBPSRR、6μA 静态电流及100mV 的压差。
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